As a result of our breakthrough technical innovations and the diverse skills of our designers, scientists and engineers, Terepac has developed an entirely new way to present electronics. This combination unleashes a world of possibilities and solves some, if not all, of your most vexing product development and solution delivery problems. From adding ‘intelligence’ to an object or device to overcoming previously imagined deal breaker limitations to transforming what was formerly thick, rigid, heavy, expensive to thin, feather light, bend-around-a-pencil flexible at market-forming pricing, we look forward to working with you.

Who should consider terepac’ing their electronics?

Would your end product benefit from being delivered in a smaller, thinner, more flexible, lighter, more condition-resistant form factor? Is the size of your circuitry and components a limiting factor in the size or design of your end product, device or component? Is it being asked to withstand conditions that as presently configured, it simply cannot?

Could your product benefit by the cost-effective addition of embedded electronics? Could it literally be “smartened up” to gather and report information? How would your company be transformed if powerful yet affordable electronics could be embedded in your products, your packaging, or even your production processes? How could your customers be better served if your product had embedded sensors or electronic “on board” intelligence? What if your product could communicate about its status, change of condition, or even communicate with other devices and adjust its behavior/response?

What sort of value would this create? What would you and your customers learn by generating previously not accessible “information capital”? How do you now become remarkably different? What new customers will be attracted? What new markets form? What existing relationships reignite?

Most importantly, how might your top line explode?

Let’s get started

We are helping clients do all of that. Now.

Recognizing that every relationship and requirement is unique, our “standard” form is engagement is as follows.

Engagements begin with a conference call or visit to our Technology Center in Waterloo, Ontario, Canada. During the initial session, we explore synergies and discuss possibilities. From here, the typical engagement consists of three phases: proof of concept, product development, and manufacturing.

Phase One: Proof of concept

Terepac is retained to undertake a preliminary proof of concept working closely with you. At this stage, we work through the most crucial issues and address the most crucial technical problems we are likely to encounter in the development and ultimate production of the end product. This stage establishes a “go/no go” outcome, typically resulting in a sufficiently robust “show and tell” that it is possible to invite potential downstream channel partners to visit and/or offers the proof of concept that allows the project to proceed to Phase Two, and clarifies that path forward.

Phase Two: Product development

This is a more substantial engagement. Here, Terepac fully develops the end product. Terepac designs and develops the new device, product or component and prepares it for production.

This phase requires process customization and lays the groundwork for any post processing that will be necessary to finish or ready the end product Terepac produces to enable frictionless integration into its next, and typically final, processing step. This final step may range from a simple introduction of the terepac’d component into the final host to a more complex packaging process involving outside vendors. We make it easy for the customer, with a one-stop shop service that provides seamless integration of our core work into your desired final format.

Because we are comfortable with any type of object, device, chip (or sensor or MEMS device), and target substrate, and can work with any form of “host” product, the possibilities are limited only by your imagination – and the requirements of your customers.

Phase Three: Manufacturing

Terepac manufactures the end product.

The time and investment at each stage relates directly to the complexity of the product, device, or component.

What can we terepac for you?