Technology for printing relatively small circuits such as are used in RFID tags, smart cards and wirelessly connected sensors is analyzed with respect to cost and suitability for the requirements of these devices. A technique for transfer printing is described, which is able to place virtually any electronic component of a form suitable for conventional surface mount processes, but which works also for those which are very thin (30 micrometers or less) and small (160 micrometers or less lateral dimension). The process uses a photosensitive polymer to achieve complete (“digital”) adhesion selectivity at high speed and with solid state control over position at all times.

See the full published article from Circuit World vol. 36, pp. 40-47, 2010 (requires registration and payment) or download the manuscript here.

A quick two-page primer providing an overview of Terepac’s value proposition, market, technology, advantage, and team.

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A two-page article in Global SMT & Packaging by Joseph Fjelstad that talks about electronics miniaturization and the Terepac process.

See full article at Global SMT & Packaging
upon registration (free)
See pages 4 & 5 of the Americas edition.

An article in EP&T by Dr. Jayna Sheats that looks at some cost and resolution challenges associated with printing electronics, and goes over the Terepac packaging process.

See full article at EP&T – or – Download the pdf