Terepac is a privately-held company headquartered in Canada’s Technology Triangle in Waterloo, Ontario. The company was founded by Ric Asselstine and Dr. Jayna Sheats in 2004 based on Dr. Sheats’ patents and Mr. Asselstine’s experience in the conventional printing industry and new venture formation. Both founders share a long-standing interest in printed electronics and pervasive computing.
Years of directed material, process, and product R&D have resulted in nearly two dozen patents and patent applications. The company has established numerous R&D relationships with academic, institutional, and corporate partners, and built a team which includes thought leaders in printed electronics, roll-to-roll processing, and flexible circuits and substrates, as well as engineers, scientists, and industry veterans of the most innovative traditional microelectronics.
In 2010, Terepac began pilot line production at its manufacturing facility near the University of Waterloo, and recently established a second facility in Dresden, Germany.
Founded in 2004, in pilot line production since 2010, and constantly driving R&D onwards, Terepac today is a high-tech nexus where the ideas of global thought leaders, top scientists, industry veterans and dedicated engineers mesh at the juncture of cutting edge microelectronics assembly.